OPTIMIZATION OF ARRANGEMENT HEAT-PRODUCING FUNCTIONAL UNITS AND RADIO ELEMENTS ON THE PRINTED CIRCUIT BOARD
DOI:
https://doi.org/10.18372/1990-5548.47.10283Keywords:
Reliability, radio electronic devices, heat-producing elements, failure, thermal field, heat, failure rate, automation, reliability calculationAbstract
In this work discusses the methods of automated arrangement of the heat-producing functionalunits on the printed circuit board. Proposed mathematical models for determination the parameters ofthermal fields in micro assemblies. The design aim to reduce the temperature of heat-producing elements,and this can be achieved by appropriately placing the latter, removing them from each other to reduceinterference and improve heat transfer. The described complex software module for temperature calculationof the electronic structure elements established on the basis of micro assembly, and performance of itsreliabilityReferences
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