Ping H, Yatsenko MV. THE FOLDING PARADIGM: DRIVING PACKAGING INNOVATION THROUGH STRUCTURAL ENGINEERING, KINEMATICS, AND MATERIAL INTELLIGENCE. TPD [Internet]. 2025 Aug. 27 [cited 2025 Dec. 5];(36):413-24. Available from: https://jrnl.nau.edu.ua/index.php/Design/article/view/20418